Educational Qualifications

2012                    
LLM in Intellectual Property Law, University of Edinburgh, UK

2002                    
MBA, Macquarie University, Australia

1998                    
PhD in Materials Engineering, University of Erlangen-Nuremberg, Germany

1993                    
MSc in Laser Engineering & Applications, Heriot-Watt University, UK

1992                    
BEng (Hons) in Electrical & Electronic Engineering, University of Hertfordshire, UK

Academic and Professional Experience

2016 – Present     
Head, IP and Innovation Management Programme, School of Business, SUSS

2009 – 2016         
Director, Capability Development, Intellectual Property Office of Singapore (IPOS)

2006 – 2009         
Assistant Director, Centre for Innovation and Enterprise, Republic Polytechnic

2004 – 2006         
Chief Executive Officer, PosiTel

2002 – 2004         
Managing Consultant, NOVUS Innovations

2001 – 2002         
Consultant, Accenture

1999 – 2001         
Research Fellow, Gintic Institute of Manufacturing Technology

1993 – 1998         
Engineering Manager, ATZ-EVUS

Selected Publications

Journal Papers:

  • Zheng Hongyu, Eric Gan and G.C. Lim, “Investigation of Laser Via Formation Technology for the Manufacturing of High Density Substrates”, Journal of Lasers & Optics in Engineering, 36, 4, pp. 355-371, 2001
  • K. Schutte, E.K.W. Gan, J. Koch, A. Lang, M. Hartmann, R. Mayerhofer, T. Slunecko and H.W. Bergmann, “A Copper Vapour Laser MOPA-Chain for Highly Efficient and Precise Material Removal”, SPIE, 3092, pp. 281-284, 1996
  • H.W. Bergmann, R. Mayerhofer, T. Slunecko, M. Hartmann and E. Gan, “Improved Drilling and Cutting with Copper Vapour Lasers”, Proc. CLEO ‘94, paper CThE3, 1994.

 

Conference Papers:

  • Eric Gan Kok Wah (2014), The Construction and Personnel Training Model of IPOS’ IP Competency Framework (IPCF), High-Profile Seminar on IP Service, CIPTC, Beijing, China
  • Eric Gan Kok Wah (2012), IP Regime in Singapore – KeyAreas of Focus and Programmes, Patent Information Annual Conference (PIAC), Beijing, China
  • Eric K.W. Gan, Zheng H.Y. and Lim G.C. (2000), Laser Drilling of Micro-Vias in PCB Substrates, IEEE Proc. 3rd Electronics Packaging Technology Conference, pp.321-326
  • Zheng Hongyu, Eric Gan and Lim Gnian Cher (2000),ATechnical Review of Laser Micro-Drilling Technologies for PCB Substrates, Electronic Manufacturing Technical Conference
  • H.W. Bergmann, M. Hartmann, T. Slunecko, E.K.W. Gan and K. Schutte (1996), Copper Vapour Laser for Fast Precision Machining, Proc. EUROPTO ’96.

 

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